该岗位会在德昌江门工厂上班，负责IC封装车间产线和制程工艺工作。
Molding & EOL Process Engineer 塑封及后段工艺工程师
Job Description & response（工作表述和职责）:
1, Experience on: Adhesion Promoter (AP) & Molding process; Laser Marking; Trim & Form equipment. 具备AP、塑封、激光印字、切筋成型工艺经验。
2, Well know about MOSFET overall assembly station. 熟悉MOSFET全封装流程。
3, Has Adhesion Promoter; Molding; Laser marking; Trim & Form machine procurement and specification experience or skill. 具备AP、塑封、激光印字、切筋成型设备采购和规格书撰写经验或能力。
4, For totally new machine setup; buyoff and release to mass production experience or skill. 具备全新设备的设置、验收和释放量产的经验或能力。
5, Good acknowledge about: Lead frame technical; Die Bond & Clip Bond & Wire bond technical; Epoxy Molding Compound (EMC) & plating solder & plating chemical properties; Trim & Form mechanism stress and laser marking properties. 关于：引线框架技术；晶粒粘贴&铜夹片粘贴&焊线技术；环氧树脂塑封料、电镀锡、电镀药水特性、切筋成型机械应力及激光印字特性等工艺技术经验和知识储备。
6, Strongly logical and engineering capabilities for AP; Molding; Plating; Laser Marking; Trim & Form process failure analysis, good experience on majority and critical defects analysis and improvement. 有较强的逻辑和工程分析能力应对AP、塑封、电镀、激光印字、切筋成型等工序失效分析，熟悉掌握各工序关键坏品分析和改善方法。
7, Good engineering analysis and logical mindset to solve the trouble shooting. 良好的工程分析和逻辑思维以便于解决产线问题解决。
8, Able to define Process and system document as WI/SOP/OCAP/PFMEA/DFMEA定义工艺及系统文件如操作指引、流程标准、OCAP、工艺&设计失效模式与影响分析等。
9, DOE and parameter optimization project experience. DOE和参数优化项目经验。
10, Machine key parts safety storage definition; lifetime validation; qualification and cost reduction. 设备关键部件安全库存的建立；寿命评估；验收和成本节约。
3628 7183-57|177 7619 5069 4811, To editable 8D report and short-term, mid-term and long-term action definition具备8D报告的撰写能力及短期、中期、长期改善行动定义。
